CMP Conditioner REV

The main feature

Connectivity

Diamond grains are fixed extremely firm in the ceramic bond.

Maintenance of composition element

The ceramic bond does not contain any transition metals. No metal contamination.

	READ	Conventional dressers
Bonding materials	Ceramics	Transition metals （plated）	Transition metals （brazed）
Hardness（Hv）	1200	600	200
Retention of diamond	◎	△	○
Metal contamination	ND level	Ni	Ni、Cr

	SS-W2000	READ	Brazed A.	Brazed B.	Brazed C.
Cr	162	152	531	1,300	195
Fe	51,755	52,796	53,696	55,000	67,060
Ni	<40	<40	9,265	3,900	291
Cu	<40	<40	<40	<40	<40
Ag	<20	<20	<20	<20	<20

CMP conditioner design

Processing example

Urethane Pad Conditioning:the status of diamond

Pad cut rate varies by CMP conditioners even using the same dressing condition

Pad surface