Diamond grains are fixed extremely firm in the ceramic bond.
The ceramic bond does not contain any transition metals. No metal contamination.
READ | Conventional dressers | ||
Bonding materials | Ceramics | Transition metals (plated) |
Transition metals (brazed) |
Hardness(Hv) | 1200 | 600 | 200 |
Retention of diamond | ◎ | △ | ○ |
Metal contamination | ND level | Ni | Ni、Cr |
SS-W2000 | READ | Brazed A. | Brazed B. | Brazed C. | |
Cr | 162 | 152 | 531 | 1,300 | 195 |
Fe | 51,755 | 52,796 | 53,696 | 55,000 | 67,060 |
Ni | <40 | <40 | 9,265 | 3,900 | 291 |
Cu | <40 | <40 | <40 | <40 | <40 |
Ag | <20 | <20 | <20 | <20 | <20 |
Pad cut rate varies by CMP conditioners even using the same dressing condition